Electronics and Telecommunications
基于混合晶圆级封装工艺的太赫兹全向AiP系统及其在芯片间无线互连中的应用
A THz omnidirectional AiP system based on hybrid wafer-level packaged process for chip-to-chip wireless interconnect applicationsA system utilizing a hybrid wafer-level packaging process to create an antenna-in-package (AiP) structure for omnidirectional transmission at Terahertz (THz) frequencies, specifically designed for chip-to-chip wireless interconnects. / 一种利用混合晶圆级封装工艺构建太赫兹频段全向天线封装（AiP）结构，专门用于芯片间无线互连的系统。
- Knowledge type
- 物理设备
- First proposed or discovered
- Proposer
- Turkey Farm member
- Creator
- 农场主
- Last updated
- 2026-11-12 20:05:24
Sub-knowledge points
Omnidirectional radiation patternHybrid wafer-level packaging processChip-to-chip wireless interconnect
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Main parameters and performance indicators
Frequency: Terahertz (THz)Packaging Process: Hybrid wafer-level packagingApplication: Chip-to-chip wireless interconnect
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Related literature
ranked by community starsA THz omnidirectional AiP system based on hybrid wafer-level packaged process for chip-to-chip wireless interconnect applicationsOpen source
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1 recordsRecord title: A THz omnidirectional AiP system based on hybrid wafer-level packaged process for chip-to-chip wireless interconnect applications.
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