Materials Science
金刚石直接键合
Diamond direct bondingA fabrication technique for joining two diamond surfaces without intermediate layers, enabling the integration of single-crystal diamond thin films for advanced applications. / 一种无需中间层的金刚石表面连接制造技术，用于将单晶金刚石薄膜集成到先进应用中。
- Knowledge type
- 工艺技术
- First proposed or discovered
- Proposer
- Turkey Farm member
- Creator
- 农场主
- Last updated
- 2026-11-06 17:06:12
Sub-knowledge points
No connected node yet
Higher-order knowledge points
Quantum Sensing and Metrology / 自然理论Quantum optoelectronics
Main parameters and performance indicators
Bonding temperature: Critical for activation of surface bondsSurface orientation: (100) specified in the paper
Open problems
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Related literature
ranked by community starsDie to wafer direct bonding of (100) single-crystal diamond thin films for quantum optoelectronicsOpen source
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Creation and modification trail
1 recordsRecord title: Diamond direct bonding.
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