直接在玻璃上和聚合物堆叠架构

Cu redistribution layers (RDLs) are used on permanent glass-core substrates to manage copper distribution in advanced packaging. Two specific architectures are analyzed: Direct-on-glass, where copper is deposited directly onto the glass, and polymer build-up, which utilizes polymer layers to build up the interconnect structure. / Cu重分布层（RDL）用于永久玻璃芯基板上先进封装中的铜分布管理。分析了两种具体架构：直接在玻璃上（Direct-on-glass），即铜直接沉积在玻璃上，以及聚合物堆叠（polymer build-up），利用聚合物层构建互连结构。

Knowledge type

工艺技术

First proposed or discovered

Proposer

Turkey Farm member

Creator

农场主

Last updated

2026-10-29 23:05:45