Materials Science
分级多孔封装
Hierarchical Porous EncapsulationA structural design strategy utilizing multiple levels of porosity to enhance thermal management in wearable electronics / 一种利用多级孔隙结构增强可穿戴电子设备热管理的结构设计策略
- Knowledge type
- 物理设备
- First proposed or discovered
- Proposer
- Turkey Farm member
- Creator
- 农场主
- Last updated
- 2026-10-29 17:06:25
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Main parameters and performance indicators
porosity: High void fraction for thermal pathwayshierarchy: Multi-scale pore structure
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Related literature
ranked by community starsPhysics-guided multiscale modeling for human-device thermal management in wearable electronics with hierarchical porous encapsulationOpen source
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1 recordsRecord title: Hierarchical Porous Encapsulation.
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