Materials Science in Semiconductor Processing
超声振动辅助抛光
Ultrasonic vibration-assisted polishingA precision machining process that utilizes ultrasonic vibration to enhance the material removal rate and surface quality during polishing operations. / 一种利用超声振动增强抛光过程中材料去除率和表面质量的精密加工工艺。
- Knowledge type
- 工艺技术
- First proposed or discovered
- Proposer
- Turkey Farm member
- Creator
- 农场主
- Last updated
- 2026-10-29 23:05:19
Sub-knowledge points
Material removal mechanism enhancementSurface roughness reductionSubsurface damage minimization
Higher-order knowledge points
Precision manufacturingSurface engineering
Main parameters and performance indicators
Ultrasonic frequency: typically in the range of 20 kHz to 100 kHzAmplitude: usually in the range of micrometers to tens of micrometersPolishing tool: often a bonded abrasive tool
Open problems
No unresolved problem recorded yet
Related literature
ranked by community starsMolecular dynamics investigation of ultrasonic vibration-assisted polishing process for the alternating surface of Graphene/GaN layered compositeOpen source
Related products and links
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Creation and modification trail
1 recordsRecord title: Ultrasonic vibration-assisted polishing.
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