Materials Science
Ti/Cu异种连接
Ti/Cu dissimilar joiningA joining process for dissimilar metals involving Ti and Cu, utilizing magnetically assisted methods, water-cooling, and high-temperature holding to control interfacial microstructure evolution. / 一种涉及Ti和Cu异种金属的连接工艺，利用磁辅助方法、水冷和高温保持来控制界面微观结构演变。
- Knowledge type
- 工艺技术
- First proposed or discovered
- Proposer
- Turkey Farm member
- Creator
- 农场主
- Last updated
- 2026-11-01 23:05:17
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Main parameters and performance indicators
Magnetic field: Assists the processWater-cooling: Applied during the processHigh-temperature holding: Applied during the processTi/Fe: Dissimilar materials being joined
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Related literature
ranked by community starsInsights into Ti/Cu interfacial microstructure evolution during magnetically assisted Ti/Fe dissimilar joining using water-cooling and high-temperature holdingOpen source
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1 recordsRecord title: Ti/Cu dissimilar joining.
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