semiconductor fabrication and lithography
基于界面耦合强度波动的机械剥离台面
Mechanical peeling of mesa by interfacial coupling strength fluctuationA novel fabrication process for nitride semiconductor optoelectronic devices where a mesa structure is mechanically peeled off the substrate by utilizing fluctuations in interfacial coupling strength. / 一种用于氮化物半导体光电器件的新型制造工艺，通过利用界面耦合强度的波动将台面结构机械剥离。
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- 2026-11-02 19:06:14
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ranked by community starsMechanical peeling of mesa by interfacial coupling strength fluctuation for nitride semiconductor optoelectronic devicesOpen source
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