Materials Science
大尺寸超薄硅片研磨过程中的尺寸效应与变形损伤
The size effect on deformation and damage during grinding large-size silicon wafers with ultra-thin thicknessThe study investigates the mechanical behavior of large-diameter silicon wafers during the grinding process, specifically focusing on the 'size effect' where the deformation and damage characteristics change as the wafer dimensions increase and thickness decreases. / 本研究调查了大直径硅片在研磨过程中的机械行为，特别关注随着直径增大和厚度减小而变化的'尺寸效应'。
- Knowledge type
- 工艺技术
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- Turkey Farm member
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- 农场主
- Last updated
- 2026-11-05 16:06:33
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Main parameters and performance indicators
Wafer diameter: Large size (implied by 'large-size')Wafer thickness: Ultra-thinProcess: Grinding
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ranked by community starsThe size effect on deformation and damage during grinding large-size silicon wafers with ultra-thin thicknessOpen source
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1 recordsRecord title: The size effect on deformation and damage during grinding large-size silicon wafers with ultra-thin thickness.
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