Materials Science in Semiconductor Processing
扇出面板级封装翘曲
Warpage in fan-out panel-level packagingWarpage in fan-out panel-level packaging refers to the deformation of the substrate or package due to thermomechanical stresses induced by the coefficient of thermal expansion (CTE) mismatch between the die and the substrate during thermal cycling. / 扇出面板级封装翘曲是指在热循环过程中，由于芯片与基板之间的热膨胀系数（CTE）失配引起的基板或封装变形。
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- Last updated
- 2026-11-07 21:05:59
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Main parameters and performance indicators
CTE mismatch: Thermal expansion coefficient difference between materialsThermal cycling: Temperature changes during processing and operationModulus of elasticity: Stiffness of the materials involved
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Related literature
ranked by community starsWarpage in fan-out panel-level packaging: Thermomechanical mechanisms, governing factors, and mitigation strategiesOpen source
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1 recordsRecord title: Warpage in fan-out panel-level packaging.
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