Materials Science
激光切片
Laser SlicingA non-contact material separation technique utilizing a focused laser beam to cut wafers along crystal planes. / 一种利用聚焦激光束沿晶面切割晶圆的非接触材料分离技术。
- Knowledge type
- 工艺技术
- First proposed or discovered
- Proposer
- Turkey Farm member
- Creator
- 农场主
- Last updated
- 2026-10-08 07:56:16
Sub-knowledge points
Multiscale mechanism investigationDeep learning-based processing strategy
Higher-order knowledge points
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Main parameters and performance indicators
laser type: Fiber laserwafer material: 4H-SiCdoping type: N-type or P-typeprocessing strategy: Deep learning-based
Open problems
No unresolved problem recorded yet
Related literature
ranked by community starsLaser slicing of 4H-SiC wafers with different doping types: Multiscale mechanism investigation and deep learning-based processing strategyOpen source
Related products and links
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Creation and modification trail
1 recordsRecord title: Laser Slicing.
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