Materials Science
电迁移可靠性建模
Electromigration reliability modelingA methodology for predicting the failure of electronic interconnects due to atomic diffusion driven by high current density. It involves full-physics simulations and surrogate models for efficient uncertainty quantification. / 一种用于预测高电流密度驱动下电子互连失效的方法。它涉及全物理模拟和用于高效不确定性量化的代理模型。
- Knowledge type
- 工艺技术
- First proposed or discovered
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- Turkey Farm member
- Creator
- 农场主
- Last updated
- 2026-11-12 18:06:29
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Main parameters and performance indicators
Current Density: Driving force for atomic diffusionTemperature: Accelerates diffusion kineticsTime-to-Failure: Reliability metric
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Related literature
ranked by community starsElectromigration reliability modeling: from full-physics to surrogate models for efficient uncertainty quantificationOpen source
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1 recordsRecord title: Electromigration reliability modeling.
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