Materials Science in Semiconductor Processing
化学机械平坦化
Chemical Mechanical Planarization (CMP)A material removal process used in semiconductor manufacturing to planarize wafer surfaces by combining chemical etching and mechanical abrasion. / 结合化学蚀刻与机械研磨的材料去除工艺，用于半导体制造中的晶圆表面平坦化。
- Knowledge type
- 工艺技术
- First proposed or discovered
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- Turkey Farm member
- Creator
- 农场主
- Last updated
- 2026-10-08 07:59:57
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Main parameters and performance indicators
abrasive slurry: suspension of particles used for mechanical polishingpad: polymeric material that provides a surface for slurry contactdownforce: pressure applied to the wafer and pad
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Related literature
ranked by community starsCoupled mechanical and chemical effects of slurry temperature in DETA-assisted silicon chemical mechanical planarizationOpen source
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1 recordsRecord title: Chemical Mechanical Planarization (CMP).
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