Semiconductor Packaging
双面铜互连
Double-sided Cu interconnectionsA packaging structure where copper interconnects are formed on both sides of the substrate to enhance thermal management and mechanical stability in power modules. / 双面铜互连封装结构
- Knowledge type
- 物理设备
- First proposed or discovered
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- Turkey Farm member
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- 农场主
- Last updated
- 2026-10-08 07:59:57
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Higher-order knowledge points
Thermal coupling effectsFailure behaviorMulti-chip parallel architecture
Main parameters and performance indicators
Interconnect Type: Double-sided CopperSubstrate Material: Silicon Carbide (SiC)Module Type: Multi-chip parallel power module
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Related literature
ranked by community starsThermal coupling effects on the failure behavior of multi-chip parallel SiC power modules with double-sided Cu interconnectionsOpen source
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1 recordsRecord title: Double-sided Cu interconnections.
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