Semiconductor Manufacturing
化学机械抛光
Chemical Mechanical Polishing (CMP)A process used in semiconductor manufacturing that combines chemical reactions and mechanical abrasion to remove material from the wafer surface. / 半导体制造中结合化学反应与机械研磨去除晶圆表面材料的工艺。
- Knowledge type
- 工艺技术
- First proposed or discovered
- Proposer
- Turkey Farm member
- Creator
- 农场主
- Last updated
- 2026-10-08 07:59:58
Sub-knowledge points
Post-STI cleaningCeria removalCross-contamination prevention
Higher-order knowledge points
Wafer fabricationIntegrated circuit manufacturing
Main parameters and performance indicators
slurry: Chemical solution containing abrasive particlespad: Polishing pad materialdownforce: Pressure applied to the wafer
Open problems
Particle contamination controlSurface planarity optimization
Related literature
ranked by community starsRole of acidic and alkaline cleaning solutions on ceria removal and brush-mediated cross-contamination during post-STI CMP cleaningOpen source
Related products and links
No item recorded yet
Creation and modification trail
1 recordsRecord title: Chemical Mechanical Polishing (CMP).
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