Materials Science in Semiconductor Processing
砂轮-晶圆界面演化
Grinding wheel-wafer interfacial evolutionThe progressive change in the physical and chemical state of the contact interface between a grinding wheel and a wafer during the machining process. / 砂轮与晶圆在加工过程中接触界面的物理和化学状态的渐进变化。
- Knowledge type
- 工艺技术
- First proposed or discovered
- Proposer
- Turkey Farm member
- Creator
- 农场主
- Last updated
- 2026-10-29 23:06:03
Sub-knowledge points
Grinding wheel-wafer interfacial evolution / 工艺技术Material removal mechanisms transitionSiC wafer integrity
Higher-order knowledge points
Main parameters and performance indicators
interfacial evolution: progressive change in contact statematerial removal mechanisms: transition from brittle to ductile mode
Open problems
No unresolved problem recorded yet
Related literature
ranked by community starsGrinding wheel-wafer interfacial evolution-induced transition of material removal mechanisms and its effect on SiC wafer integrityOpen source
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1 recordsRecord title: Grinding wheel-wafer interfacial evolution.
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