semiconductor fabrication
激光诱导深刻蚀
Laser-induced deep etchingA fabrication process used to create through-glass vias (TGVs) by using a laser to remove material from glass. / 一种利用激光去除玻璃材料的制造工艺，用于制作通孔。
- Knowledge type
- 工艺技术
- First proposed or discovered
- Proposer
- Turkey Farm member
- Creator
- 农场主
- Last updated
- 2026-10-30 22:05:26
Sub-knowledge points
through-glass vias (TGV) fabricationlaser modificationsidewall undulation formation
Higher-order knowledge points
semiconductor fabrication and lithographyMaterials Science in Semiconductor Processing
Main parameters and performance indicators
laser type: typically femtosecond or nanosecond lasersmaterial: glass substrateprocess: laser-induced deep etching
Open problems
controlling sidewall undulation formationmitigating glass-network-dominated instability
Related literature
ranked by community starsGlass-network-dominated instability of laser modification and sidewall undulation formation in through-glass vias fabricated by laser-induced deep etchingOpen source
Related products and links
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Creation and modification trail
1 recordsRecord title: Laser-induced deep etching.
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