Thermal Engineering
集管微通道
Manifold microchannelsA cooling architecture consisting of parallel microchannels connected to a common manifold header to manage high heat fluxes in electronics / 一种冷却架构，由连接到公共集管头的平行微通道组成，用于管理电子设备中的高热通量
- Knowledge type
- 工艺技术
- First proposed or discovered
- Proposer
- Turkey Farm member
- Creator
- 农场主
- Last updated
- 2026-11-10 19:05:43
Sub-knowledge points
Thermal-hydraulic optimizationExperimental validation
Higher-order knowledge points
High-heat-flux liquid coolingSuperconducting electronics cooling
Main parameters and performance indicators
Heat flux: High levels requiring advanced coolingChannel diameter: Micro-scale dimensionsFlow rate: Optimized for thermal-hydraulic performance
Open problems
Optimization of thermal-hydraulic performanceExperimental validation of cooling efficiency
Related literature
ranked by community starsHigh-heat-flux liquid cooling of electronics with manifold microchannels: Thermal-hydraulic optimization and experimental validationOpen source
Related products and links
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Creation and modification trail
1 recordsRecord title: Manifold microchannels.
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