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Materials Science in Semiconductor Processing

选择性化学湿法刻蚀

Selective chemical wet etching

A microfabrication process used to remove specific regions of a material, such as B-doped Si0.8Ge0.2 epitaxial layers, by immersing the substrate in a chemical solution. / 一种微加工工艺,通过将基板浸入化学溶液中来去除特定区域的材料,例如硼掺杂的Si0.8Ge0.2外延层。

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Last updated
2026-10-30 22:05:45
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Selective chemical wet etching of B-doped Si0.8Ge0.2 epitaxial layers for multistacked memory devicesOpen source

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automated knowledge publish农场主2026-10-30 22:05:45

Record title: Selective chemical wet etching.