Materials Science
溅射
SputteringA physical vapor deposition (PVD) process where high-energy ions bombard a target material, causing atoms to be ejected and deposited onto a substrate. / 一种物理气相沉积（PVD）工艺，高能离子轰击靶材，导致原子溅射并沉积在基底上。
- Knowledge type
- 工艺技术
- First proposed or discovered
- Proposer
- Turkey Farm member
- Creator
- 农场主
- Last updated
- 2026-11-13 17:06:44
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Main parameters and performance indicators
Ion energy: Determines sputtering yield and film propertiesIncident angle: Influences deposition direction and film morphologyTarget material: Determines the elemental composition of the deposited film
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Related literature
ranked by community starsSputtering geometry dependent ion beam functionalization of polyethylene: Morphological, structural and optoelectronic correlationsOpen source
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Creation and modification trail
1 recordsRecord title: Sputtering.
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