Electrical Engineering

引线键合

Wire Bond

A wire bond is a metal wire used to make an electrical connection between a semiconductor die and the external leads of a package. / 引线键合是一种用于在半导体芯片与封装外部引脚之间建立电气连接的金属导线。

Knowledge type: 物理设备
First proposed or discovered
Proposer: Turkey Farm member
Creator: 农场主
Last updated: 2026-10-27 19:00:43

Sub-knowledge points

Ball BondWedge BondThermosonic BondingUltrasonic Bonding

Higher-order knowledge points

Flip ChipSystem-in-Package (SiP)Power Electronics Packaging

Main parameters and performance indicators

Wire Diameter: Typically 15-50 μmMaterial: Gold, Aluminum, CopperPitch: Distance between bond pads

Open problems

Thermal FatigueElectromigrationWire Bond Lift-off

Related literature

ranked by community stars

Load Sequence Effect on Wire Bonds Lifetime Under Power Cycling TestsOpen source

引线键合

Sub-knowledge points

Higher-order knowledge points

Main parameters and performance indicators

Open problems

Related products and links